? 2004 california micro devices corp. all rights reserved. 02/13/04 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 1 cm1401-03 4-channel esd/emi filter array plus 4-channel esd array for usb features ? functionally and pin compatible with cspemi307a device optiguard tm coated for improved reliability at assembly four channels of combined emi/rfi filtering + esd protection four additional channels of esd-only protection 40db absolute attenuation (typical) at 1 ghz 35db attenuation (typical) at 1 ghz relative to pass band + 15kv esd protection on all channels (iec 61000-4-2 level 4, contact discharge) + 30kv esd protection on all channels (hbm) 15-bump, 2.960mm x 1.330mm footprint chip scale package (csp) chip scale package features extremely low lead inductance for optimum filter and esd performance lead-free version available applications emi filtering and esd protection for both data and i/o ports outer 4 channels provide esd protection for usb lines and other i/o port applications wireless handsets handheld pcs / pdas mp3 players notebooks desktop pcs product description the cm1401-03 is a multichannel array with four low- pass filter + esd channels and four esd-only chan- nels. they reduce emi/rfi emissions on a data port and protect against esd on a usb port. each emi/rfi channel integrates a high quality pi-style filter (c-r-c) which provides greater than 30db attenuation in the 800-2700 mhz range relative to the pass band attenu- ation. these pi-style filter s are bidirecti onal, controlling emi both to and from a data port connector. the cm1401-03 provides a high-level of esd protec- tion on all eight channels for sensitive electronic com- ponents that may be subjected to electrostatic discharge (esd). the input pins are designed and characterized to safely dissipate esd strikes of 15kv, exceeding the maximum requirement of the iec 61000-4-2 international standard. using the mil-std- 883 (method 3015) specification for human body model (hbm) esd, the device provides protection for contact discharges to greater than 30kv. the cm1401-03 is particularly well suited for portable electronics (e.g., cellular telephones, pdas, notebook computers) because of its small package footprint and low weight. the cm1401-03 incorporates optiguard tm coating which results in improved reliability at assembly and is available in a space-saving, low-profile chip scale package with optional lead-free finishing. electrical schematic 100 ? 30pf 30pf filter+esdn* gnd filter+esdn* 1 of 4 emi/rfi + esd channels. (pins b1-b3) 30pf esdn* 1 of 4 esd-only channels * see package/pinout diagram for expanded pin information
? 2004 california micro devices corp. all rights reserved. 2 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 02/13/04 cm1401-03 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices are specified by using a " + " character for the top side orientation mark. pin descriptions pin(s) name description a1 esd_1 esd channel 1 a2 filter+esd_1 filter + esd channel 1 a3 filter+esd_2 filter + esd channel 2 a4 filter+esd_3 filter + esd channel 3 a5 filter+esd_4 filter + esd channel 4 a6 esd_2 esd channel 2 b1-b3 gnd device ground c1 esd_3 esd channel 3 c2 filter+esd_1 filter + esd channel 1 c3 filter+esd_2 filter + esd channel 2 c4 filter+esd_3 filter + esd channel 3 c5 filter+esd_4 filter + esd channel 4 c6 esd_4 esd channel 4 n013 4 3 26 5 1 c b a orientation marking (see note 2) filter/esd_4 esd_2 gnd filter/esd_4 esd_4 a6 a5 orientation marking b3 c6 c5 filter/esd_2 filter/esd_3 gnd filter/esd_2 filter/esd_3 a4 a3 b2 c4 c3 esd_1 filter/esd_1 gnd esd_3 filter/esd_1 a2 a1 b1 c2 c1 a1 package / pinout diagrams bottom view csp package (bumps up view) top view (bumps down view) cm1401-03 notes: 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. part numbering information pins package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 15 csp cm1401-03cs n013 CM1401-03CP n013
? 2004 california micro devices corp. all rights reserved. 02/13/04 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 3 cm1401-03 specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: clamping voltage is measured at the opposite side of the emi filter to the esd pin. for example, if esd is applied to pi n a2, then clamping voltage is measured at pin c2. note 4: unused pins are left open note 5: these parameters are guaranteed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 600 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics (see note1) symbol parameter conditions min typ max units r resistance 80 100 120 ? c capacitance at 2.5v dc 24 30 36 pf tcr temperature coefficient of resistance 1200 ppm/c tcc temperature coefficient of capacitance at 2.5v dc -300 ppm/c v diode diode voltage (reverse bias) i diode =10 a5.5 v i leak diode leakage current (reverse bias) v diode =3.3v 100 na v sig signal voltage positive clamp negative clamp i load = 10ma 5.6 -0.4 6.8 -0.8 9.0 -1.5 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2,4 and 5 30 15 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients notes 2,3,4 and 5 +10 -5 v v f c cut-off frequency z source =50 ? , z load =50 ? r=100 ? , c=30pf 58 mhz
? 2004 california micro devices corp. all rights reserved. 4 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 02/13/04 cm1401-03 performance information typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 1. insertion loss vs. frequency (a2-c2 to gnd b2) figure 2. insertion loss vs. frequency (a3-c3 to gnd b2)
? 2004 california micro devices corp. all rights reserved. 02/13/04 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 5 cm1401-03 performance information typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 3. insertion loss vs. frequency (a4-c4 to gnd b2) figure 4. insertion loss vs. frequency (a5-c5 to gnd b2)
? 2004 california micro devices corp. all rights reserved. 6 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 02/13/04 cm1401-03 performance information typical filter performance (t a =25c, 50 ohm environment) figure 5. comparison of filter response curves for cm1401-03cs with dc bias
? 2004 california micro devices corp. all rights reserved. 02/13/04 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 7 cm1401-03 performance information (cont?d) figure 6. filter capacitance vs. input voltage over temperature (normalized to capacitance at 2.5vdc and 25c) figure 7. resistance vs. temperature (normalized to resistance at 25c) 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 012345 dc input voltage (v) normalized capacitance t = -40c t = +25c t = +70c 0.900 0.920 0.940 0.960 0.980 1.000 1.020 1.040 1.060 1.080 1.100 -40 -20 0 20 40 60 80 100 temperature ['c] nornalized re s i s tance
? 2004 california micro devices corp. all rights reserved. 8 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 02/13/04 cm1401-03 application information refer to application note ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 8. recommended non-solder mask defined pad illustration figure 9. eutectic (snpb) solder ball reflow profile figure 10. lead-free (snagcu) solder ball reflow profile printed circuit board recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds soldering maximum temperature 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2004 california micro devices corp. all rights reserved. 02/13/04 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 9 cm1401-03 mechanical details csp mechanical specifications cm1401-03 devices are packaged in a custom chip scale package (csp). dimensions are presented below. for complete information on csp packaging, see the california micro devices csp package infor- mation document. package dimensions for cm1401-03 chip scale package csp tape and reel specifications figure 11. tape and reel mechanical data package dimensions package custom csp bumps 15 dim millimeters inches min nom max min nom max a1 2.915 2.960 3.005 0.1148 0.1165 0.1183 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.600 0.670 0.739 0.0236 0.0264 0.0291 d2 0.394 0.445 0.495 0.0155 0.0175 0.0195 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b c 3456 c1 b1 a1 b3 c2 d1 d2 a2 bottom view side view 12 b2 b4 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating dimensions in millimeters part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1401-03 2.96 x 1.33 x 0.67 3.10 x 1.45 x 0.74 8mm 178mm (7") 3500 4mm 4mm top for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
|
